HP R&D INTERVIEW PROCESS

I attend HP R&D interview thro’ my oncampus recruitment. Totally there are 3 rounds. Totally there are 3 rounds.

1. Written test – contains upto 6 to 7 sections that includes english (writing letter or email) , dbms , networks , os , c or cpp or java (anyone language) , aptitude questions , comprehension questions , logical questions…

note : sectional cutoff is there and will give you another section questions only when you return the previous section question and answers within time.

2 . Technical round – it will be around 45 to 75 minutes interview (mostly depends upon panel members). some panel will be very technical. some panel will be not less than HR interview.

3. HR round  - it will be around 20 minutes interview. it is an formal interview to know about candidates.

note: in our college, there are 6 to 7 panels. some are very technical and some are jovial. it is our luck to be in good panel. for HP R&D , we must be very technical. Mostly development is going on HP than the research.